They can be widely used to control equipments. The company shall assume no responsibility for any problem involving a patent caused when applying the descriptions in the example. Derate by 8. The wiring density and the material of the set board must be chosen for thermal conductance of efficacy board. And P C max cannot be over the value of P T. Small and light surface-mount packages require spicial attentions on solder mounting.
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They can be widely used to control equipments. Input Interference Output offset voltage arb. Derate by 8. Design spec. Keep safety first in your circuit designs! Nippon Bldg. Renesas Technology Corp. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as i placement of substitutive, auxiliary circuits, ii use of nonflammable material or iii prevention against any malfunction or mishap.
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The information described here may contain technical inaccuracies or typographical errors. Please also pay attention to information published by Renesas Technology Corp. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products.
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Renesas Technology America, Inc. Kukje Center Bldg. Printed in Japan.
HA17324A Renesas Electronics Corporation., HA17324A Datasheet
Accordingly, although Hitachi, Ltd. Thank you for your understanding. Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself. Customer Support Dept.
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